All Synova Systems

Turnkey Systems

Synova’s state-of-the-art laser cutting machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet® technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical stress.

Our tools have been repeatedly field proven and are used for 24-hour-a-day industrial production.

Synova currently offers several types of water jet guided laser cutting machines:

LCS (Laser Cutting Systems)

LCS 50

LCS 50

The LCS 50 with 3 or 5 axes is Synova’s most compact and cost-efficient Laser MicroJet® machine. The LCS 50 is ideal for finish-machining of diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing.  

LCS 305

LCS 305

The LCS 305 with 5 axes is specifically designed for the automatic production of larger and multi-tooth diamond cutting tools. The CNC machine with five synchronous axes is characterized by a particularly intelligent machine concept and highly dynamic axes for maximum precision and speed.

LCS 150

LCS 150

The LCS 150 is a versatile laser cutting system conceived for micro-machining applications, such as cutting, drilling or grooving for a variety of industrial sectors. Different laser sources are available for this machine, allowing up to 200 W. 

LCS 300

LCS 300

The LCS 300 is Synova’s workhorse and most sold machine. This laser cutting system has a working area of 300 x 300 mm and enables high-precision machining of almost all metals, super-hard materials and ceramic for the watch, medical and tool making industry as well as precision mechanics.

LCS 800

LCS 800

The 3-axis laser cutting machine LCS 800 with integrated Laser MicroJet® technology is a robust and versatile system conceived for a multitude of high-precision cutting and drilling applications in different industrial sectors. The large mounting table allows machining of virtually any part size and is suited for small series and prototypes but also for large volumes.

DCS (Diamond Cutting Systems)

DCS 50

DCS 50

The DCS 50 is Synova’s most compact diamond machining system. The 3-axis machine is designed for cutting pointers (0.1 to 1.5 cts.). The DCS 50 with two additional rotary axes also allows high precision coning, blocking and fancy shaping. 

DCS 150

DCS 150

The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds. 

DCS 300

DCS 300

This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. 

DCS 30

DCS 30

The DCS 30 is Synova’s entry-level model and most compact diamond cutting system. The 2-axis machine is designed for high-precision sawing of pointers and small diamonds up to 2 carats.

MCS (Metal Cutting Systems)

MCS 300

MCS 300

The MCS 300 integrates Synova’s Laser MicroJet® technology with a Makino-based platform. The 3-axis machine enables high-precision metal and hard material machining such as cutting, drilling and grooving.

MCS 500

MCS 500

The MCS 500 in Makino’s machine platform offers a precise XYZ stage, a large sturdy mounting table and a cast iron machine frame. With its simultaneous 5 axes function is specifically designed for 3D machining needs and drilling in industrial gas turbine and jet engine components. 

LDS (Laser Dicing Systems)

LDS 300 M

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

LDGS 300 A

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

LMJ-iP (Laser MicroJet Integration Package)

Integration Modules

Besides offering complete turnkey systems, Synova also provides the core components of the Laser MicroJet® machines, allowing manufacturing companies to integrate the modules directly into their own machine or production lines.

LMJ-iP

LMJ-iP

The Laser MicroJet® Integration Package (LMJ-iP) principally consists of three main components; the laser source, the water pump containing the water treatment, and the optical head with camera, supplied for customer integration.

XLS (XL Laser Cutting Systems)

XLS 1005

XLS 1005

The XLS Laser Cutting System integrates Synova’s state-of-the-art Laser MicroJet® (LMJ) technology with a wide machine platform and table for large work pieces. The 5-axis XLS 1005 with optional C2 rotary axis allows high-precision 2D and 3D machining of metals and ceramics, free of heat affected zone (HAZ) and burrs.

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Industrial Applications

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