The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
LMJ machines are able to perform dicing or scribing of brittle thin wafers, such as low-k wafers or compound wafers, multi-directional 2D-cutting providing engineers with the capability to create new chip shapes spanning T-cuts and circular designs with the same quality as standard die patterns.
Different laser sources (Green, UV, IR) can be integrated into LMJ systems to tackle future applications.
Synova’s LMJ systems are low-cost-of-ownership tools that demand very few consumables and no tool wear. The high-throughput capability especially for thin wafers combined with its nearly damage-free technology (no HAZ, chipping, no micro-cracks, no burrs, no deposition) allows customers to realize cost benefits by increasing yield.
Silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), low-K materials and coated materials such as Epoxy molded compound wafers
Multi-directional 2D-cutting, grooving, dicing, edge grinding
- Smooth and Gentle
- Smooth edges
- High wafer fracture strength and less risk of breakage
- Virtually no heat impact thanks to water jet cooling capability
- Fast and Accurate
- Cutting speed of up to 200 mm/s for thin wafers (< 50 µm)
- High precision with a tolerance of +/- 3 μm
Very small kerf width (down to 30 μm)
- Clean and Easy
- Clean surfaces and no depositions
- No or very little post treatment required
- No focus control necessary due to long working distance
|Version||LDS 300 M|
|Working volume||mm (W x D)||300 x 300|
|Number of axes||2-axis|
|Laser Type|| Diode pumped solid state Nd:
|Dimensions machine||mm (W x D x H)||1165 x 950 x 1920|
|Dimensions cabinet||mm (W x D x H)||700 x 2300 x 1600|