Videos

Watch our latest application video showcasing high-precision tube processing. Discover how our 5-axis S-50 machine, powered by our proprietary Laser MicroJet®, achieves outstanding cutting precision, making it an ideal solution for small workpieces in the medical industry.

Experience the precision of our Laser MicroJet® technology as it processes a SiC wafer for the semiconductor industry. This video showcases our S-303 machine executing multiple cutting shapes, including wafer dicing, hole drilling, and sharp triangles cutting.

Discover the capabilities of our LCS 303 3-axis laser cutting system while processing a wafer for the semiconductor industry. Whether it's wafer downsizing, notch, or flat cutting, our Laser MicroJet® is renowned for its high precision and reliability.

Engineered for the precision cutting of small workpieces, our 5-axis machines effortlessly handle even the most complex 3D applications. With a dynamic moving axis and advanced water jet guided laser, our technology can achieve incredible results with no limit to your creativity!

Explore the capabilities of our Laser MicroJet® as it tackles the challenge of cutting Ceramic Matrix Composites, one of the toughest materials around. Our system guarantees precise and clean cuts without causing thermal damage, making it ideal for working with hard and brittle materials.

Discover the capabilities of our LCS 303 3-axis machine while cutting one of the toughest materials: Ceramic Matrix Composites. Cutting this ultra-hard and brittle material is particularly challenging, but our laser MicroJet® excels in handling even the most demanding materials with exceptional precision.

Watch how a small piece of stainless steel is cut and shaped into a delicate lady figure by our Laser Microjet®. Our water jet guided laser can remove the material in a single operation, ensuring no thermal damage and preserving a smooth surface with impeccably sharp edges.

Discover the capabilities of our water jet laser as it effortlessly cuts through a 0.65 mm-thick alumina ceramic plate. Experience the finesse of our cutting applications, from slotting to drilling, all while maintaining flawless precision that prevents micro-cracks and thermal damage.

Our LCS 303 can process a wide variety of materials, from ultra hard and brittle materials such as ceramics, to complex composites. In this video, you will see how our laser cut through a 15 mm thick piece of Zirconia toughened Alumina without inducing any micro-cracks.

Cutting oscillating masses made out of heavy metals such as tungsten is a demanding task because tungsten is a difficult material to machine. In this video, you will see how precisely the LCS 303 cuts fancy shapes of oscillating masses without thermal damage or deformation.

The "DaVinci Diamond Factory" is an automated laser cutting & shaping system for diamonds. In this video, you see the processes involved in cutting a 4 mm thick CVD diamond, from planning to determining the facet cutting order and alignment to shaping the heart in one go.

See how the water jet guided Laser MicroJet® effortlessly cuts tough titanium and challenging ceramics. The LCS 303 laser cutting system produces intricate functional parts with minimal material loss and excellent surface quality.

In this video, you will see how Synova's 3-axis LCS 303 cuts a thin-walled shape from a 15 mm thick piece of silicon carbide (SiC), an advanced ceramic material that is extremely hard and brittle.

Watch this video to see ablation with Laser MicroJet. The logo is engraved into a 4 mm thick silicon carbide disk of 64 mm diameter - vertical walls and low thermal damage

This video shows the fancy shaping process of a Tsavorite gemstone with an Emerald cut, using our 5-axis DaVinci laser cutting system - an automated laser cutting and shaping system for diamonds.

Watch this video to see how a PCD endmill is cut with Synova's 5-axis LCS 50.

The DCS 300 diamond cutting system is particularly well suited for cutting larger diamonds (5 carats or more). Watch this video, from Venus Jewel - World Leaders in Solitaires, to see how a 143.45 Cts diamond is cut.

The 3-axis LCS 303 is a highly accurate and reliable laser cutting system. Applications include high precision machining of watch components, medical devices, and electronic parts. Watch this video to see how a 0.7mm thin piece of ceramic (alumina) is cut.

This video shows the cutting, faceting and turning functions of the LMJ with the DCS 50, forming an PCD circular saw blade within 2 hours, which is 3 times faster than a conventional laser could do.

To celebrate our company anniversary we cut the anniversary logo out of 6 mm thick brass. Watch this video to see how to cut a seal stamp with our DCS 50.

This video shows fine 5 x 3 mm geometries with hair-thin walls being cut into a 1 mm thick copper plate using the LCS 303.

This video shows the edge trimming of a 20 mm thick Silicon Carbide (SiC) Boule, reducing its diameter from 150 mm to 148 mm using the LCS 300.

The hybrid LMJ method combines a laser with a hair-thin water jet. The cylindrical beam can be guided over a large working distance of up to 100 mm, enabling parallel high aspect ratio kerfs. This video shows fine cutting in thick metals with LMJ, namely the cutting of spinneret forms.

This video explains how to protect backwalls by blowing air or using a water jet to disturb the laser beam after material breakthrough (for parts with difficult access to back walls such as turbine blades) or by using protective material such as Teflon for open parts.

To generate slices from grown CVD diamond crystals (further used as seeds), the following steps must be carried out:                                    Coring: Removal of PCD-graphite layer

Slicing: Cutting cube in thin slices

The application video shows the process of cutting steps out of a 7 mm thick silicon carbide piece and then slicing all steps in one go - without height adjustment and taper!

Watch this video to see how Laser MicroJet® (LMJ) is used to 3D cut a watch case from a aluminium block.

Watch this video to see how Laser MicroJet® (LMJ) is used to cut tool inserts for a rotation tool. Polycrystalline diamond (PCD) on tungsten carbide (WC); Thickness: 2mm (0.5mm PCD and 1.5mm WC); Effective processing speed: above 4.5mm/min; Clearance angle: from 1 to 45°. 

Watch this video to see how Laser MicroJet® (LMJ) is used to cut 45 mm long slots into silicon. Material: Silicon; Thickness: 7.7 mm; Effective processing speed: under 2 min per slot. Slots were cut under 2 minutes on average. Waste parts fall down and can be recycled. 

Watch this video to see how Laser MicroJet® (LMJ) is used to machine a chess figure (pawn) using laser turning process. Complex profile followed while workpiece rotates at 400 rpm; Aluminium rod: 3 mm diameter; Ra (roughness): 0.4 μm. 

All 57 facets of the diamond are cut in a single operation. The breakthrough sensor recognizes when a facet cut is complete and then automatically initiates facet changing. Cut offs are collected instead of polished away. The result is a fully shaped round brilliant. 

Synova's LMJ is used to cut a 5 mm hole in 10 mm thick superalloy: Superalloy thickness: 10 mm; Laser power: 40W in the water jet; Roughness: RA 0.7um ISO 4287; Cycle time: 4 min 30 sec; Taper angle: 0.036°. 

This video shows how cutting 1 mm diameter holes in 8 mm thick polycrystalline silicon using Synova Laser MicroJet®.

Cycle time: 22 seconds

Taper angle: 0.036°

This video shows how hexagons with a total lenght of 3 mm are cut into 18 mm thick aluminium using Laser MicroJet.
The side length is 1.73 mm and the cycle time is 2 min 50 secs.

Synova Laser MicroJet® is used to cut squares in 5 mm thick stainless steel. 
The cycle time is 40 seconds.

LMJ used to cut a contact ledge from a cubic boron nitride (CBN) block. The video nicely demonstrates multiple operations in a single process: cutting, drilling, 5-axis chamfering and profiling. Initial dimensions of the CBN block: Size: 12 x 7 mm; Thickness: 5 mm.