All diamond cutting systems incorporate Synova’s Laser MicroJet® (LMJ) technology, whereby a laser beam is guided by a hair-thin water jet. The combination results in single-side processing, parallel walls, tight kerf widths, unmatched surface finishes, higher yields and minimal weight loss.
Diamond Cutting Systems
DCS (Diamond Cutting Systems)
DCS 50
The DCS 50 is Synova’s most compact diamond machining system. The 3-axis machine is designed for cutting pointers (0.1 to 1.5 cts.). The DCS 50 with two additional rotary axes also allows high-precision coning, blocking and fancy shaping.
DaVinci Diamond Factory
"DaVinci Diamond Factory" is an automated laser cutting and shaping system for diamonds. Rough diamonds can be transformed into brilliant cut diamonds with up to 57 facets in a single process. The DaVinci system also allows fancy shaping.
DCS 150
The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds.
DCS 300
This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds.
DCS 30
The DCS 30 is Synova’s entry-level model and most compact diamond cutting system. The 2-axis machine is designed for high-precision sawing of pointers and small diamonds up to 2 carats.