DCS 300

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This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. 

Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.



  • Rough diamonds
  • Laboratory grown diamonds (CVD, HPHT)



3-axis machine: Sawing, pie sawing, coring, slicing


Key Benefits

  • Easy
    • No focus control necessary due to long working distance
    • No blackening, no opening, no double sawing needed
    • Very little post treatment required
  • Profitable
    • Minimal weight loss and low risk of breakage
    • Fast cutting time and easy processing
    • Diamond sawing in mass production
  • Straight and Smooth
    • Smooth cutting surfaces and sharp edges
    • Cylindrical beam resulting in perfectly parallel kerfs (no V-shape)
    • Virtually no heat impact thanks to the water jet cooling capability



General Specifications

Version    DCS 300
Working volume mm (W x D x H)   300 x 300 x 100
 Accuracy µm    +/- 3
 Repeatability µm   +/- 1
 Number of axes      3-axis 
 Laser Type      Diode pumped solid state Nd: 
YAG, pulsed
Wavelength nm   532
Dimensions machine mm (WxDxH)   1165 x 950 x 1920
Dimensions cabinet mm (WxDxH)   700 x 2300 x 1600