SYNOVA S.A., headquartered in Duillier, Switzerland, manufactures advanced laser cutting systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet®) in a true industrial CNC platform. Customers benefit from significant yield and improved cutting quality as well as enhanced capabilities for precision machining a wide range of materials.
The Synova Story
SYNOVA’s story begins with the invention of the water jet guided laser developed in the 1990s at the Federal Institute of Technology (EPFL) in Lausanne, Switzerland, made by PhD student Bernold Richerzhagen. This innovation resolved a number of well-known problems associated with existing cutting technologies in industrial applications. Consequently, Synova was founded by Richerzhagen in 1997 in Lausanne to make the patented Laser MicroJet (LMJ) technology available to high-tech industrial manufacturers.
Since 1998, various industries worldwide have switched to this laser process for their production needs. In addition, the particular advantages have led to a number of new applications such as in the domain of sensitive material processing where Synova was the first company to introduce the laser into semiconductor wafer dicing in 2001.
Since 2003, the company established wholly owned local subsidiaries in the USA, Japan, India and Korea for optimized customer support. These have since been expanded to include micro-machining centers (MMCs) with Germany and China in preparation.
SYNOVA presently has 100 employees including 35 engineers focused primarily on researching new material cutting solutions, further applications and laser cutting equipment. Aside from research, both the final assembly and testing of up to 100 machines a year are performed in Synova’s modern, 2300 square meter facility in Duillier.
In 2010 Synova successfully entered the gem diamond cutting business. Subsequently, the company was strategically re-organized according to market segments forming three distinct business units: Diamonds, Semiconductors and Metal Industry.
SYNOVA has established several partnerships with leading industrial machine manufacturers for the production of LMJ machines, most recently with Makino. The company also cooperates with respected research institutions, universities and industry players on strategic projects to further develop and exploit the technology, including the Fraunhofer ILT and IPT, EMPA and Carl Zeiss Jena.
SYNOVA is now a company with global reach focused on delivering highest-quality solutions and services to its customers wherever they are. We strongly believe that the motor of our success and growth are our technology, experience and dedication to our customers, today and tomorrow.
Over 350 LMJ systems sold worlwide
First automated laser full faceting solution for round brilliants: DaVinci Diamond Factory
Launch of 5-axis laser machining center LCS 305 for automatic production of high-precision diamond tools
New Dual Laser for high quality processing of new materials in watch industry
Introduction of XL laser cutting system XLS 1005 for 2D and 3D machining of large workpieces
Relocation of international headquarteres to larger premises in Duillier (Nyon), Switzerland
Synova celebrates its 20th anniversary
New 5-axis MCS 500 for 3D machining and hole-drilling of jet engine components
813-carat "Constellation Diamond" laser cut with Synova's DCS 300
New distribution agreement with Makino/ SST for North American Market
Synova and Makino introduce the HybridCell (MCS 500/EDBV8)
De Beers Group of Companies entered as a new minority shareholder
Launch of first laser cutting system with 5 axes: LCS 50-5
|2014||Partnership with GE and Makino for production of GE gas turbine parts|
Introduction of three business units: Diamonds, Metal Industry, Semiconductors
OEM agreement with Makino for the manufacture of LMJ machines based on Makino platform (MCS)
|2011||Launch of Diamond Cutting Systems (DCS)|
|2010||Entry in gem diamond cutting business|
|2007||Extension of existing business model through technology licensing partnerships and LMJ Integration Package (LMJ-iP)|
|2006||Beginning of global expansion efforts with implementation of Micro-Machining Centers (MMCs) for customer application tests|
First Laser Stencil (LSS) and Edge Grinding Systems (LGS)
Relocation of international headquarters to Ecublens-Lausanne, Switzerland
|2001||Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS)|
Foundation of Synova S.A.
Numerous awards for LMJ breakthrough invention
|1993||Invention of the water jet guided laser technology (LMJ) at the EPFL in Switzerland|
Technology Innovation Award (Europe, Israel, Africa)
Laser MicroJet: One of “World’s Most Amazing Breakthroughs in Science & Technology”
Frost & Sullivan
McGraw-Hill Yearbook of Science & Technology, U.S.A.
Second Best Tool for Wafer Processing
European Award for technology Innovation
EuroAsia IC Industry
Frost & Sullivan
|2004||Entrepreneur of the Year 2004 (Finalist)||Ernst & Young|
|1997||Förderpreis Technopark Zürich||Technopark Zürich|
|1997||Technologiestandort Schweiz||OSEC, Swiss Center for Trade Promotion|
|1997||Sonderpreis Espace Mittelland||Cantons of Central Switzerland|
|1996||KTI-Label||Swiss Innovation Promotion Agency, Bern|