Case Studies

How Our Clients Use LMJ Systems

With its customized solutions, Synova helps companies to be one step ahead of the competition.

Take a look at the case studies below to get a detailed insight of customer applications.

Energy and Aviation

Processing of CMC Shrouds

CHALLENGE

Synova's Laser MicroJet (LMJ) was used to drill Ceramic Matrix Composite (CMCshrouds. Laser MicroJet's gentle, precise, and high-volume processing for an exigent aero application is of advantage. 

Application Areas

Energy and Aviation

Material

Ceramic Matrix Composite (CMC)

Process

Drilling

Processing of Aero-Engine Components

CHALLENGE

LMJ: aero-engine components. Drilling, milling, cutting up to a few mm thickness.

Application Areas

Energy and Aviation

Material

Ceramic Matrix Composite (CMC)
Ni Superalloy

Process

Drilling
Milling
Cutting

Drilling of Turbine Blades

CHALLENGE

Synova's Laser MicroJet (LMJ) was used to drill cooling holes in turbine blades in coated superalloy. Chipping or micro cracking of the coating can be avoided thanks to this gentle process.

Application Areas

Energy and Aviation

Material

Coated Superalloy

Process

Drilling

High-Speed Drilling of Shaped Holes

CHALLENGE

High-speed drilling of shaped holes in blades and vanes with LMJ for industrial gas turbines, no thermal stress and minimal recast. 

Application Areas

Energy and Aviation

Material

Alloys

Process

Drilling
Shaping

Drilling of Gas Turbine Blades

CHALLENGE

Drilling of industrial gas turnine blades by avoiding heat related problems and maintaining high productivity by the use of LMJ. 

Application Areas

Energy and Aviation

Material

Alloys

Process

Drilling
Shaping

Tool Manufacturing

Cutting of CBN Blanks without Heat Damage

CHALLENGE

When cutting CBN (Cubic Boron Nitride) blanks with LMJ the result exceeds the quality of dry laser cutting as heat damages and rough edges are avoided.                                                 

Application Areas

Tool Manufacturing

Material

Polycrystalline Cubic Boron Nitride (CBN)

Process

Cutting

Cutting of Binderless Polycrystalline Diamond

CHALLENGE

Fabricating top quality discs made of Binderless Polycrystalline Diamond with LMJ is less time- and tool-consuming than with conventional methods such as grinding.

Application Areas

Tool Manufacturing

Material

Binderless Polycrystalline Diamond (BLPCD)

Process

Cutting

Pre-Cutting of Tool Inserts

CHALLENGE

When using LMJ to cut diamond tool inserts 99% of the diamond material can be removed at high speed before a final polishing step.

Application Areas

Tool Manufacturing

Material

HPHT Crystal

Process

Pre-Cutting

Cutting PCD and CBN Tools

CHALLENGE

Cutting PCD, CBN tools: no micro cracks, HAZ, oxidation possible with LMJ. Verticality, narrow tolerances, low roughness, and sharp edges.

Application Areas

Tool Manufacturing

Material

Tungsten
Carbide Substrate

Process

Finishing

Super Hard Tool Making

CHALLENGE

Synova's Laser MicroJet's (LMJ) higher quality 3D machining of inserts and complex multi-tip tools enables new applications with better operating cost.

Application Areas

Tool Manufacturing

Material

Tungsten

Process

Cutting

Diamonds and Jewelry

Cutting of Large Diamonds

The Graff Lasedi La Rona

CHALLENGE

The Graff Lasedi La Rona is the largest highest color, highest clarity diamond ever certified by the GIA. Thanks to parallel cutting with LMJ the weight loss is minimal.

Application Areas

Diamonds & Jewelry
Cutting of Large Diamonds

Material

Natural Diamond

Process

Cutting

The Queen of Kalahari

CHALLENGE

The 342-carat rough diamond has resulted in a set of 23 diamonds, the Garden of Kalahari. Highest precision could be achieved thanks to LMJ.

Application Areas

Diamonds & Jewelry
Cutting of Large Diamonds

Material

Natural Diamond

Process

Cutting

The Constellation

CHALLENGE

The 813-carat Constellation Diamond is the most expensive rough diamond in the world. The resulting 313-carat ‘Constellation One’ is the largest D color emerald cut diamond ever.

Application Areas

Diamonds & Jewelry
Cutting of Large Diamonds

Material

Natural Diamond

Process

Cutting

143.45 Carat Diamond

CHALLENGE

This expensive and valuable diamond has been cut to perfection. Laser MicroJet technology ensures minimal weight loss thanks to parallel cutting.

Application Areas

Diamonds & Jewelry
Cutting of Large Diamonds

Material

Natural Diamond

Process

Cutting

Cutting for Jewelry Industry

Hole Drilling for Jewellery

CHALLENGE

To link the diamond with the other jewellery part, a hole-drilling process might be required. With LMJ the drilled holes are fully straight, no V-shape, no chipping at the hole entry and exit.

Application Areas

Diamonds & Jewelry
Cutting for Jewelry Industry

Material

Natural Diamond

Process

Hole-Drilling

Fancy Bruting

CHALLENGE

The LMJ is advantageously for fancy bruting due the its perfect cut at the outline of the diamond to create the shape profile. Less post-processing is required.

Application Areas

Diamonds & Jewelry
Cutting for Jewelry Industry

Material

Natural Diamond

Process

Bruting

Cutting of Lab Grown Diamonds

Slicing of a CVD Crystal

CHALLENGE

The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.

Application Areas

Diamonds & Jewelry
Cutting of Lab Grown Diamonds

Material

CVD Crystal

Process

Slicing

Slicing of a HPHT Diamond

CHALLENGE

The goal is to get a maximum number of slices out of the HPHT crystal (high pressure, high temperature) and to cut variable thicknesses ranging up to 12 mm.

Application Areas

Diamonds & Jewelry
Cutting of Lab Grown Diamonds

Material

HPHT Crystal

Process

Slicing

Coring and Slicing of a CVD Crystal

CHALLENGE

With LMJ there was an improvement in yield, straightness, smoothness, cracks, and throughput in coring and slicing CVD crystals.

Application Areas

Diamonds & Jewelry
Cutting of Lab Grown Diamonds

Material

CVD Crystal

Process

Slicing
Coring

Coring for Graphite Removal

CHALLENGE

The use of LMJ ensures a high quality coring and slicing process of CVD crystals and smooth surfaces as well as low roughness what requires minimal post treatments.

Application Areas

Diamonds & Jewelry
Cutting of Lab Grown Diamonds

Material

CVD Crystal

Process

Slicing
Coring

Lab Grown Diamond Material for Industry

CHALLENGE

The LMJ is used for cutting components with free froms with high accuracy requirements (± 5 μm) from CVD crystals.

Application Areas

Diamonds & Jewelry
Cutting of Lab Grown Diamonds

Material

CVD Crystal

Process

Slicing
Coring
3D Form Cuts

CVD Seed Slicing

CHALLENGE

The challenge was to slice large CVD crystals (chemical vapor deposition) of up to 25 mm from a single direction and along the largest thickness, with a high quality.

Application Areas

Diamonds & Jewelry
Cutting of Lab Grown Diamonds

Material

CVD Crystal

Process

Slicing
Coring

Watchmaking

Cutting of Watch Components for Luxury Watches

CHALLENGE

With very short warm-up and set-up times Synova's Laser MicroJet (LMJ) is a flexible and stable tool to cut watch components for luxury watches, no matter if it's for production or prototyping.

Application Areas

Watchmaking

Material

Gold

Process

Cutting

Cutting of Oscillating Parts

CHALLENGE

The LMJ is used to cut oscillating monolithic parts with complex shapes without deformation or heat affected zone but with the capacity to cut very thin bridges.

Application Areas

Watchmaking

Material

Steel
Copper

Process

Cutting

Cutting of Watch Dials and Markers

CHALLENGE

The LMJ is used to cut large series of up to 2mm thick decorative watch components.

Application Areas

Watchmaking

Material

Gold
Steel
Brass

Process

Drilling
Cutting

Micro-Machining of High-Tech Parts

CHALLENGE

The LMJ is used for micromachining of high-tech parts reaching top quality/tolerances and better return on investment.

Application Areas

Watchmaking

Material

Metal
Ceramics

Process

Drilling
Cutting

Medical

Cutting of Silicon Blades

CHALLENGE

The silicon blades for the first single-use, safety engineered surgical knife designed for use in cutting corneal tissue were cut with Synova's LMJ. 

Application Areas

Medical

Material

Silicon

Process

Cutting

Cutting of Nitinol Stents

CHALLENGE

LMJ was the perfect choice to receive a controlled/homogeneous roughness, narrow tolerances, no HAZ, and no reduction in strength cut cardiovasculaire stents.

Application Areas

Medical

Material

Nitinol

Process

Cutting

Semiconductors and Photovoltaics

Downsizing of Silicon Wafers

CHALLENGE

The LMJ is used for gentle, precise, and fast processing for large inline production of power semiconductor devicesLow contamination of the workpiece is crucial. 

Application Areas

Semiconductors & Photovoltaics

Material

Silicon

Process

Cutting

Singulation of Silicon Wafers

CHALLENGE
The LMJ  is used for hexagonal square or circular dies singulation for PressFIT Diodes and achieves a much better edge quality compared to grinding. 

Application Areas

Semiconductors & Photovoltaics

Material

Silicon with gold coating

Process

Cutting

Dicing of Ceramic Circuits

CHALLENGE

With LMJ, it was possible to establish a repeatabel, high-speed process for singulating substrates without damaging the adjacent circuitry.

Application Areas

Semiconductors & Photovoltaics

Material

Ceramics

Process

Dicing

Wafer Dicing

CHALLENGE

LMJ: wafer dicing, device singulation. Elimination of high operational costs for blades.

Application Areas

Semiconductors & Photovoltaics

Material

Natural Diamond
Silicon Carbide
Advanced Materials such as GaN

Process

Dicing
Singulation

Drilling of Holes in Ceramic Substrates

CHALLENGE

Drilling of via holes in ceramic substrates of thin film circuits with LMJ eliminates the hole-cleaning step and reduces cost of ownership versus CO2 lasers.

Application Areas

Semiconductors & Photovoltaics

Material

Metal Deposition
Photolithography

Process

Drilling

Cutting of IGTB Power Chips

CHALLENGE

 LMJ is the perfect choice to cut silicon carbide which is a challenging material to cut because of its hardness and brittleness. In this case it is used for IGTB Power Chips.

Application Areas

Semiconductors & Photovoltaics

Material

Silicon Carbide

Process

Edge Grinding
Edge Trimming

Edge Trimming of CMOS Image Sensors

CHALLENGE

LMJ is used to trim edges of CMOS image sensors and proves superiority over EDM by significantly higher quality. 

 

Application Areas

Semiconductors & Photovoltaics

Material

Silicon

Process

Edge Trimming
Downsizing

Complementary Metal Oxide

CHALLENGE

Silicon frames are very brittle and request a gentle processing technology without any micro cracks and chipping. LMJ reaches high accuracy, straight walls, low roughness and is highly flexible.

Application Areas

Semiconductors & Photovoltaics

Material

Silicon

Process

Cutting

Taiko Ring Removal

CHALLENGE

 Thin wafers are challenging to manipulate and to process due to the high flexibility and fragility. With LMJ the perfect TAIKO ring removal becomes possible. 

 

Application Areas

Semiconductors & Photovoltaics

Material

Silicon

Process

Cutting

Cutting of Platinum-Iridium

CHALLENGE

LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.

Application Areas

Semiconductors & Photovoltaics

Material

Platinum-Iridium

Process

Dicing
Single Die Cutting

Chamfer Cutting

CHALLENGE

 LMJ is used to downsize 450mm silicon semiconductor wafers to 300mm and 200mm wafers, without any impact on the material.

Application Areas

Semiconductors & Photovoltaics

Material

Silicon

Process

Downsizing

Cutting of LED Chips

CHALLENGE

LED chips and packages are made of materials that are frequently difficult to cut mechanically. With LMJ one has high flexibility regarding materials and shapes. 

Application Areas

Semiconductors & Photovoltaics

Material

Indium Gallium Nitride

Process

Cutting

Semiconductor Reactor Sub-Assemblies

CHALLENGE

LMJ is used for micro-machining semiconductor reactor sub-assembly parts with tight tolerances on thick,  hard materials in contact with reactive gas.

Application Areas

Semiconductors & Photovoltaics

Material

Ceramics
Silicon
Silicon Carbide
Advanced Composites

Process

Drilling

Other MicroMachining Applications

High-Tech Parts

CHALLENGE

Laser MicroJet (LMJ) is used for micro-machining of high-tech components for the watch, medtech, space and defense industry. It is the perfect tool for flexible, stable and heat damage-free processes.

Application Areas

Other Micro-Machining Applications

Material

Various

Process

Micro-Machining

Shaver Caps

CHALLENGE

LMJ for prototyping, cutting, drilling of demanding shaver caps. Requirements met: damage-free, vertical, and precise processing.

Application Areas

Other Micro-Machining Applications

Material

Stainless Steel

Process

Drilling
Cutting
Prototyping

CuBe

CHALLENGE
LMJ used for prototyping on CuBe, damage-free cutting and drilling. LMJ has high flexibility for lower production volumes, no deburring needed.

Application Areas

Other Micro-Machining Applications

Material

CuBe

Process

Drilling
Cutting
Prototyping

High-Tech Components

CHALLENGE

LMJ, heat damage-free processing high-tech components; medtech, micro-machining.

Application Areas

Other Micro-Machining Applications

Material

Various

Process

Drilling
Cutting
Prototyping

Cutting of Platinum Electrodes

CHALLENGE

The main challenge to cut platinum electrodes is to reach to the electrode which is welded more than 20mm deep in a cylinder. Processing with LMJ is much faster than with EDM. 

Application Areas

Other Micro-Machining Applications

Material

Platinum

Process

Cutting

Cutting of Electrical Components

CHALLENGE

Synova's Laser MicroJet (LMJ) is used to cut difficult-to-machine metal alloys for electrical components reaching high edge quality and accuracy. 

Application Areas

Other Micro-Machining Applications

Material

Metal Alloys

Process

Cutting

Shadow Mask Patterning

CHALLENGE

LMJ is used to cut and drill thin nickel masks, so called shadow mask patterning. Nickel foils are challenging to cut/ablate due to the large size and low thickness.

Application Areas

Other Micro-Machining Applications

Material

Nickel Foils

Process

Drilling
Cutting

Cutting of High-Precision Metal Parts

CHALLENGE

Synova's Laser Cutting System (LCS) 800 was used for job shop of high precision parts. In this case, throughput and flexibility increased while quality remained the same as with etching and electroforming.

Application Areas

Other Micro-Machining Applications

Material

Metal

Process

Cutting