Synova's Laser MicroJet (LMJ) was used to drill Ceramic Matrix Composite (CMC) shrouds. Laser MicroJet's gentle, precise, and high-volume processing for an exigent aero application is of advantage.
Case Studies
How Our Clients Use LMJ Systems
With its customized solutions, Synova helps companies to be one step ahead of the competition.
Take a look at the case studies below to get a detailed insight of customer applications.
- Advanced Composites
- Advanced Materials such as GaN
- Alloys
- Binderless Polycrystalline Diamond (BLPCD)
- Brass
- CVD Crystal
- Carbide Substrate
- Ceramic Matrix Composite (CMC)
- Ceramics
- Coated Superalloy
- Copper
- CuBe
- Gold
- HPHT Crystal
- Indium Gallium Nitride
- Metal
- Metal Alloys
- Metal Deposition
- Natural Diamond
- Ni Superalloy
- Nickel Foils
- Nitinol
- Photolithography
- Platinum
- Platinum-Iridium
- Polycrystalline Cubic Boron Nitride (CBN)
- Silicon
- Silicon Carbide
- Silicon with gold coating
- Stainless Steel
- Steel
- Tungsten
- Various
Energy and Aviation
Processing of Aero-Engine Components
LMJ: aero-engine components. Drilling, milling, cutting up to a few mm thickness.
Application Areas
Energy and AviationMaterial
Ceramic Matrix Composite (CMC)Ni Superalloy
Process
DrillingMilling
Cutting
Drilling of Turbine Blades
Synova's Laser MicroJet (LMJ) was used to drill cooling holes in turbine blades in coated superalloy. Chipping or micro cracking of the coating can be avoided thanks to this gentle process.
Application Areas
Energy and AviationMaterial
Coated SuperalloyProcess
DrillingHigh-Speed Drilling of Shaped Holes
High-speed drilling of shaped holes in blades and vanes with LMJ for industrial gas turbines, no thermal stress and minimal recast.
Application Areas
Energy and AviationMaterial
AlloysProcess
DrillingShaping
Drilling of Gas Turbine Blades
Drilling of industrial gas turnine blades by avoiding heat related problems and maintaining high productivity by the use of LMJ.
Application Areas
Energy and AviationMaterial
AlloysProcess
DrillingShaping
Tool Manufacturing
Cutting of CBN Blanks without Heat Damage
When cutting CBN (Cubic Boron Nitride) blanks with LMJ the result exceeds the quality of dry laser cutting as heat damages and rough edges are avoided.
Application Areas
Tool ManufacturingMaterial
Polycrystalline Cubic Boron Nitride (CBN)Process
CuttingCutting of Binderless Polycrystalline Diamond
Fabricating top quality discs made of Binderless Polycrystalline Diamond with LMJ is less time- and tool-consuming than with conventional methods such as grinding.
Application Areas
Tool ManufacturingMaterial
Binderless Polycrystalline Diamond (BLPCD)Process
CuttingPre-Cutting of Tool Inserts
When using LMJ to cut diamond tool inserts 99% of the diamond material can be removed at high speed before a final polishing step.
Application Areas
Tool ManufacturingMaterial
HPHT CrystalProcess
Pre-CuttingCutting PCD and CBN Tools
Cutting PCD, CBN tools: no micro cracks, HAZ, oxidation possible with LMJ. Verticality, narrow tolerances, low roughness, and sharp edges.
Application Areas
Tool ManufacturingMaterial
TungstenCarbide Substrate
Process
FinishingSuper Hard Tool Making
Synova's Laser MicroJet's (LMJ) higher quality 3D machining of inserts and complex multi-tip tools enables new applications with better operating cost.
Application Areas
Tool ManufacturingMaterial
TungstenProcess
CuttingDiamonds and Jewelry
Cutting of Large Diamonds
The Graff Lasedi La Rona
The Graff Lasedi La Rona is the largest highest color, highest clarity diamond ever certified by the GIA. Thanks to parallel cutting with LMJ the weight loss is minimal.
Application Areas
Diamonds & JewelryCutting of Large Diamonds
Material
Natural DiamondProcess
CuttingThe Queen of Kalahari
The 342-carat rough diamond has resulted in a set of 23 diamonds, the Garden of Kalahari. Highest precision could be achieved thanks to LMJ.
Application Areas
Diamonds & JewelryCutting of Large Diamonds
Material
Natural DiamondProcess
CuttingThe Constellation
The 813-carat Constellation Diamond is the most expensive rough diamond in the world. The resulting 313-carat ‘Constellation One’ is the largest D color emerald cut diamond ever.
Application Areas
Diamonds & JewelryCutting of Large Diamonds
Material
Natural DiamondProcess
Cutting143.45 Carat Diamond
This expensive and valuable diamond has been cut to perfection. Laser MicroJet technology ensures minimal weight loss thanks to parallel cutting.
Application Areas
Diamonds & JewelryCutting of Large Diamonds
Material
Natural DiamondProcess
CuttingCutting for Jewelry Industry
Hole Drilling for Jewellery
To link the diamond with the other jewellery part, a hole-drilling process might be required. With LMJ the drilled holes are fully straight, no V-shape, no chipping at the hole entry and exit.
Application Areas
Diamonds & JewelryCutting for Jewelry Industry
Material
Natural DiamondProcess
Hole-DrillingFancy Bruting
The LMJ is advantageously for fancy bruting due the its perfect cut at the outline of the diamond to create the shape profile. Less post-processing is required.
Application Areas
Diamonds & JewelryCutting for Jewelry Industry
Material
Natural DiamondProcess
BrutingCutting of Lab Grown Diamonds
Slicing of a CVD Crystal
The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.
Application Areas
Diamonds & JewelryCutting of Lab Grown Diamonds
Material
CVD CrystalProcess
SlicingSlicing of a HPHT Diamond
The goal is to get a maximum number of slices out of the HPHT crystal (high pressure, high temperature) and to cut variable thicknesses ranging up to 12 mm.
Application Areas
Diamonds & JewelryCutting of Lab Grown Diamonds
Material
HPHT CrystalProcess
SlicingCoring and Slicing of a CVD Crystal
With LMJ there was an improvement in yield, straightness, smoothness, cracks, and throughput in coring and slicing CVD crystals.
Application Areas
Diamonds & JewelryCutting of Lab Grown Diamonds
Material
CVD CrystalProcess
SlicingCoring
Coring for Graphite Removal
The use of LMJ ensures a high quality coring and slicing process of CVD crystals and smooth surfaces as well as low roughness what requires minimal post treatments.
Application Areas
Diamonds & JewelryCutting of Lab Grown Diamonds
Material
CVD CrystalProcess
SlicingCoring
Lab Grown Diamond Material for Industry
The LMJ is used for cutting components with free froms with high accuracy requirements (± 5 μm) from CVD crystals.
Application Areas
Diamonds & JewelryCutting of Lab Grown Diamonds
Material
CVD CrystalProcess
SlicingCoring
3D Form Cuts
CVD Seed Slicing
The challenge was to slice large CVD crystals (chemical vapor deposition) of up to 25 mm from a single direction and along the largest thickness, with a high quality.
Application Areas
Diamonds & JewelryCutting of Lab Grown Diamonds
Material
CVD CrystalProcess
SlicingCoring
Watchmaking
Cutting of Watch Components for Luxury Watches
With very short warm-up and set-up times Synova's Laser MicroJet (LMJ) is a flexible and stable tool to cut watch components for luxury watches, no matter if it's for production or prototyping.
Application Areas
WatchmakingMaterial
GoldProcess
CuttingCutting of Oscillating Parts
The LMJ is used to cut oscillating monolithic parts with complex shapes without deformation or heat affected zone but with the capacity to cut very thin bridges.
Application Areas
WatchmakingMaterial
SteelCopper
Process
CuttingCutting of Watch Dials and Markers
The LMJ is used to cut large series of up to 2mm thick decorative watch components.
Application Areas
WatchmakingMaterial
GoldSteel
Brass
Process
DrillingCutting
Medical
Cutting of Silicon Blades
The silicon blades for the first single-use, safety engineered surgical knife designed for use in cutting corneal tissue were cut with Synova's LMJ.
Application Areas
MedicalMaterial
SiliconProcess
CuttingCutting of Nitinol Stents
LMJ was the perfect choice to receive a controlled/homogeneous roughness, narrow tolerances, no HAZ, and no reduction in strength cut cardiovasculaire stents.
Application Areas
MedicalMaterial
NitinolProcess
CuttingSemiconductors and Photovoltaics
Downsizing of Silicon Wafers
The LMJ is used for gentle, precise, and fast processing for large inline production of power semiconductor devices. Low contamination of the workpiece is crucial.
Application Areas
Semiconductors & PhotovoltaicsMaterial
SiliconProcess
CuttingSingulation of Silicon Wafers
The LMJ is used for hexagonal square or circular dies singulation for PressFIT Diodes and achieves a much better edge quality compared to grinding. |
Application Areas
Semiconductors & PhotovoltaicsMaterial
Silicon with gold coatingProcess
CuttingDicing of Ceramic Circuits
With LMJ, it was possible to establish a repeatabel, high-speed process for singulating substrates without damaging the adjacent circuitry.
Application Areas
Semiconductors & PhotovoltaicsMaterial
CeramicsProcess
DicingWafer Dicing
LMJ: wafer dicing, device singulation. Elimination of high operational costs for blades.
Application Areas
Semiconductors & PhotovoltaicsMaterial
Natural DiamondSilicon Carbide
Advanced Materials such as GaN
Process
DicingSingulation
Cutting of IGTB Power Chips
LMJ is the perfect choice to cut silicon carbide which is a challenging material to cut because of its hardness and brittleness. In this case it is used for IGTB Power Chips.
Application Areas
Semiconductors & PhotovoltaicsMaterial
Silicon CarbideProcess
Edge GrindingEdge Trimming
Edge Trimming of CMOS Image Sensors
LMJ is used to trim edges of CMOS image sensors and proves superiority over EDM by significantly higher quality.
Application Areas
Semiconductors & PhotovoltaicsMaterial
SiliconProcess
Edge TrimmingDownsizing
Complementary Metal Oxide
Silicon frames are very brittle and request a gentle processing technology without any micro cracks and chipping. LMJ reaches high accuracy, straight walls, low roughness and is highly flexible. |
Application Areas
Semiconductors & PhotovoltaicsMaterial
SiliconProcess
CuttingTaiko Ring Removal
Thin wafers are challenging to manipulate and to process due to the high flexibility and fragility. With LMJ the perfect TAIKO ring removal becomes possible.
Application Areas
Semiconductors & PhotovoltaicsMaterial
SiliconProcess
CuttingCutting of Platinum-Iridium
LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.
Application Areas
Semiconductors & PhotovoltaicsMaterial
Platinum-IridiumProcess
DicingSingle Die Cutting
Chamfer Cutting
LMJ is used to downsize 450mm silicon semiconductor wafers to 300mm and 200mm wafers, without any impact on the material.
Application Areas
Semiconductors & PhotovoltaicsMaterial
SiliconProcess
DownsizingCutting of LED Chips
LED chips and packages are made of materials that are frequently difficult to cut mechanically. With LMJ one has high flexibility regarding materials and shapes.
Application Areas
Semiconductors & PhotovoltaicsMaterial
Indium Gallium NitrideProcess
CuttingSemiconductor Reactor Sub-Assemblies
LMJ is used for micro-machining semiconductor reactor sub-assembly parts with tight tolerances on thick, hard materials in contact with reactive gas.
Application Areas
Semiconductors & PhotovoltaicsMaterial
CeramicsSilicon
Silicon Carbide
Advanced Composites
Process
DrillingOther MicroMachining Applications
High-Tech Parts
Laser MicroJet (LMJ) is used for micro-machining of high-tech components for the watch, medtech, space and defense industry. It is the perfect tool for flexible, stable and heat damage-free processes.
Application Areas
Other Micro-Machining ApplicationsMaterial
VariousProcess
Micro-MachiningShaver Caps
LMJ for prototyping, cutting, drilling of demanding shaver caps. Requirements met: damage-free, vertical, and precise processing.
Application Areas
Other Micro-Machining ApplicationsMaterial
Stainless SteelProcess
DrillingCutting
Prototyping
CuBe
LMJ used for prototyping on CuBe, damage-free cutting and drilling. LMJ has high flexibility for lower production volumes, no deburring needed. |
Application Areas
Other Micro-Machining ApplicationsMaterial
CuBeProcess
DrillingCutting
Prototyping
High-Tech Components
LMJ, heat damage-free processing high-tech components; medtech, micro-machining.
Application Areas
Other Micro-Machining ApplicationsMaterial
VariousProcess
DrillingCutting
Prototyping
Cutting of Platinum Electrodes
The main challenge to cut platinum electrodes is to reach to the electrode which is welded more than 20mm deep in a cylinder. Processing with LMJ is much faster than with EDM.
Application Areas
Other Micro-Machining ApplicationsMaterial
PlatinumProcess
CuttingShadow Mask Patterning
LMJ is used to cut and drill thin nickel masks, so called shadow mask patterning. Nickel foils are challenging to cut/ablate due to the large size and low thickness.
Application Areas
Other Micro-Machining ApplicationsMaterial
Nickel FoilsProcess
DrillingCutting