DCS 300 complete set up: DCS 300 machine, laser module, water pump with water treatment unit
This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds.
Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.
Materials:
- Rough diamonds
- Laboratory grown diamonds (CVD, HPHT)
Operations:
3-axis machine: Sawing, pie sawing, coring, slicing
Key Benefits
- Easy
- No focus control necessary due to long working distance
- No blackening, no opening, no double sawing needed
- Very little post treatment required
- Profitable
- Minimal weight loss and low risk of breakage
- Fast cutting time and easy processing
- Diamond sawing in mass production
- Straight and Smooth
- Smooth cutting surfaces and sharp edges
- Cylindrical beam resulting in perfectly parallel kerfs (no V-shape)
- Virtually no heat impact thanks to the water jet cooling capability
General Specifications
| Version | DCS 300 | ||
| Working volume | mm (W x D x H) | 300 x 300 x 100 | |
| Accuracy | µm | +/- 3 | |
| Repeatability | µm | +/- 1 | |
| Number of axes | 3-axis | ||
| Laser Type | Diode pumped solid state Nd: YAG, pulsed |
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| Wavelength | nm | 532 | |
| Dimensions machine | mm (WxDxH) | 1165 x 950 x 1920 | |
| Dimensions cabinet | mm (WxDxH) | 700 x 2300 x 1600 | |