The DCS 30 is Synova’s entry-level model and most compact diamond cutting system. The 2-axis machine is designed for high-precision sawing of pointers and small diamonds up to 2 carats.
Materials:
- Rough diamonds
Operations:
- Sawing
Key Benefits
- Easy and Clean
- No focus adjustment
- No distance control
- Clean cutting surfaces
- Profitable
- Minimal weight loss (30 µm nozzle)
- Low risk of breakage
- High cutting speed
- Straight and Smooth
- Parallel kerf walls (no V-shape)
- Smooth surface quality
- No heat damage
General Specifications
| Version | DCS 30 | ||
| Working volume | mm (X, Y, Z) | 150 x 100 x 50 | |
| Accuracy | µm | +/- 5 | |
| Repeatability | µm | +/- 3 | |
| Number of axes | 2-axis | ||
| Laser Type | Diode pumped solid state Nd:YAG, pulsed, air-cooled | ||
| Wavelength | nm | 532 | |
| Dimensions (with utilities) | mm (W x D x H) | 2160 x 735 x 1600 | |
| Weight | kg (approx.) | 500 | |