DCS 150

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The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds. 

Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.



Rough diamonds

Laboratory grown diamonds (CVD, HPHT)



3-axis machine: Sawing, coring, slicing




Key Benefits

  • Easy
    • No focus control necessary due to long working distance
    • No blackening, no opening, no double sawing needed
    • Very little post treatment required
  • Profitable
    • Minimal weight loss and low risk of breakage
    • Fast cutting time and easy processing
    • Diamond sawing in mass production
  • Straight and Smooth
    • Smooth cutting surfaces and sharp edges
    • Cylindrical beam resulting in perfectly parallel kerfs (no V-shape)
    • Virtually no heat impact thanks to the water jet cooling capability



General Specifications

Version    DCS 150
Working volume mm (W x D x H)   150 x 150 x 100
 Accuracy µm    +/- 5
 Repeatability µm   +/- 2
 Number of axes     3-axis 
 Laser Type      Diode pumped solid state Nd: 
YAG, pulsed
Wavelength nm   532
Dimensions machine mm (W x D x H)   1050 x 800 x 1870
Dimensions cabinet mm (W x D x H)   700 x 2300 x 1600