SYNOVA established four wholly owned local subsidiaries in the USA, Japan, Korea and India for optimized customer support. These have since been expanded to include micro-machining centers (MMCs). We plan for the future to develop our presence worldwide with new MMCs in Germany, Taiwan and China.
These subsidiaries serve as competence centers for demonstrations, sample testing and application developments. In addition, they offer regional micro-machining services for the industrial, diamond and semiconductor industries. The establishment of customer support centers in key locations throughout the globe fortifies Synova’s expansion efforts, providing an optimum environment for the company to better serve its worldwide customer base.
The Synova MMC India is based in Surat, the world’s largest diamond cutting and polishing center. To the diamond processing industry here, Synova is pleased to offer the DCS 300, the DCS 150 and the DCS 50 laser cutting systems, thereby catering to almost the entire range of diamond sizes that the industry processes. Through their unique technology that harmoniously balances light, water and air, Synova offers diamond processors the never-before-experienced advantages of savings in terms of laser sawing weight loss reduction, greatly reduced sawing time, as well as reduced damages during sawing. The MMC in Surat is also available for job shop services.
For its MMC at Tokyo, Synova teams with Makino, a renowned Industrial Machine Manufacturer. This partner center bolsters Synova’s commitment to supporting its customer base in Japan and continues to fuel industry adoption of its Laser MicroJet® technology. Synova’s sales and support center enables Synova to strengthen its foothold in a region that is home to some of the world’s largest electronics manufacturers. The Tokyo MMC also allows Synova to serve the needs of its Japanese customers quickly and efficiently.
Synova opened its MMC Korea in Sung Nam where is the geographic center of Korea and close to Seoul and also to the world leading semiconductor manufacturing companies. A MMC in the region facilitates more rapid service satisfying customers’ expectation in one of the fastest moving countries in the world. Since it’s opening in 2012 MMC Korea has been well received by customers in a very short time in Semiconductor, LED, FPD, and Electronics industries. Not only semiconductor materials such as Si, SiC, GaAs etc., but also thin metals and ultra-hard materials such as PCD, CBN etc., can be processed with its LDS 300 system. Customers also utilize the center’s job shop service for low volume productions.
The U.S. micro-machining center in Secaucus, New Jersey (relocated from Fremont, California) supports customers throughout the North American region. The MMC is equipped with a DCS 50 and a LCS 300 M Laser MicroJet machine that are ideal for machining of thin metals and ceramics for industrial and medical applications, and cutting of hard materials such as monocrystalline and polycrystalline diamond (CVD, PCD), cubic boron nitride (CBN) or Silicon Carbide (SiC) as well as semiconductor dicing of silicon and III-V materials. Diamond-processing services are also offered. The use of the MMC is particularly well suited for feasibility testing, application development, early hardware builds, qualification runs, prototyping and low volume productions.