Diamond Cutting Systems

All diamond cutting systems incorporate Synova’s Laser MicroJet® (LMJ) technology, whereby a laser beam is guided by a hair-thin water jet. The combination results in single-side processing, parallel walls, tight kerf widths, unmatched surface finishes, higher yields and minimal weight loss.

DCS (Diamond Cutting Systems)

DCS 50

DCS 50

The DCS 50 is Synova’s most compact diamond machining system. The 3-axis machine is designed for cutting pointers (0.1 to 1.5 cts.). The DCS 50 with two additional rotary axes also allows high precision coning, blocking and fancy shaping. 

DCS 150

DCS 150

The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds. 

DCS 300

DCS 300

This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. 

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Typical Applications

These machines are ideal for the following industries: