Performance Capabilities

The Strenghts of the Laser MicroJet


The water jet guided method is a very gentle process. Therefore the Laser MicroJet (LMJ) technology is particularly well-suited for machining brittle materials that are easily damaged using traditional cutting processes. In addition, the LMJ method allows machining of a broad range of materials.

  • Diamonds: Rough and laboratory grown diamonds
  • Metals: Stainless steel, aluminium, copper, brass, shape-memory alloys (Nitinol), CuBe, titanium, nickel, superalloys
  • Hard materials: Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), monocrystalline diamond (MCD), chemical-vapor-deposition diamond (CVD)
  • Ceramics: Zirconia (ZrO2), low-temperature co-fired ceramic (LTCC), Aluminium nitride (AlN), Aluminium oxide (Al2O3)
  • Semiconductors: Silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC)


Thanks to its versatile technology, the LMJ can be used for a multitude of processes including cutting, drilling, edge-grinding, grooving, scribing, milling, dicing, shaping in 3 and 5 axes, trenching, profiling and engraving.


LMJ machines allow omni-directional ablation processes, making the creation of any shape possible. This provides customers with the flexibility to develop new ideas and applications, from making small wheels for the watchmaking sector to dicing chips of any shapes in the semiconductor industry.


The LMJ can cut a wide range of material thicknesses, e.g. cutting of up to 20 mm thick silicon or drilling of up to 15 mm thick superalloy (hole diameter 800 µm).


The usage of industrial high-power lasers enables high cutting speeds, especially with thin materials: up to 200 mm/ s in 50 µm thick silicon, up to 30’000 round holes/hour in 50 µm thick stainless steel (diameter 80 µm).


The lasers used in Synova’s machines are ultra-precise tools which can achieve very small parallel kerfs – from 20 to 150 µm – with an absolute precision of +/- 3 µm, resulting in appreciable material savings.


Thanks to the water jet cooling capability there is virtually no heat impact. The ablated material is removed with the water flow leaving clean surfaces and less scrap.


The efficient and precise LMJ technology enables low running costs: no tool wear, very few consumables and low waste rates.



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Synova Technology Brochure


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LMJ Animation Video

Laser MicroJet in 3D in 3 minutes:

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Typical Applications