LMJ machines are able to perform dicing or scribing of brittle thin wafers, such as low-k wafers or compound wafers, multi-directional 2D-cutting providing engineers with the capability to create new chip shapes spanning T-cuts and circular designs with the same quality as standard die patterns.
Different laser sources (Green, UV, IR) can be integrated into LMJ systems to tackle future applications.
Synova’s LMJ systems are low-cost-of-ownership tools that demand very few consumables and no tool wear. The high-throughput capability especially for thin wafers combined with its nearly damage-free technology (no HAZ, chipping, no micro-cracks, no burrs, no deposition) allows customers to realize cost benefits by increasing yield.
