C-205 - SYNOVA

C-205

The C-205 is the most compact 5-axis machine in the C-Series. It is designed for precision cutting and 3D shaping of small workpieces, including aerospace components, semiconductor parts, and diamond tools. It can process a wide variety of materials, from metals and brittle ceramics to ultra-hard materials like diamond and complex composites.

The C-205 is equipped with additional B and C rotary axes, enabling 3D cutting and shaping.

Built on a dedicated CNC platform distinct from Synova’s S-Series, the C-Series models are powered by the LMJ technology, which includes the following core components:

An advanced optical head with a micro-coupling unit,
A high-power laser source,
An efficient water pump, and
A water treatment system.

Materials

Diamond materials: Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), monocrystalline diamond (MCD), chemical-vapor-deposition (CVD) diamond, natural diamond (ND), tungsten carbide (WC)

Metals and alloys: Stainless steel, gold, Durnico, CuBe, copper, brass, aluminium, shape-memory alloys (Nitinol), titanium, nickel, superalloys etc.

Ceramics: Ceramic-matrix composites (CMCs), silicon carbide (SiC), silicon nitride (SiN), zirconia (ZrO2), HTCC/ LTCC, aluminium nitride (AlN), aluminium oxide (Al2O3)

Operations

5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, engraving, turning

Key Benefits

Sharp and Smooth
- Cylindrical beam resulting in parallel kerfs (no V-shape)
- Smooth cutting surfaces and sharp edges (Ra as low as 0.15 μm)
- Virtually no heat impact thanks to water jet cooling capability
Fast and Accurate
- Finish cutting of 1.6 mm PCD and cemented carbide in 5 mm/min.
- High mechanical precision with a tolerance of +/- 3 μm
- Very small kerf width (down to 30 μm)
Clean and Easy
- - Clean surfaces, no depositions or burrs
  - No or very little post treatment required
  - No laser focusing or distance control required

General Specifications

Version		C-205
Processing range (incl. tooling)	mm (W x D x H) / Ø x H	125 x 120
Positioning accuracy (X,Y,Z)	µm	+/- 5
Repeatablility (X,Y,Z)	µm	+/- 3
Number of axes		5-axis
Laser types		Diode pumped solid state, pulsed
Wavelength	nm	532
Dimensions (machine)	mm (W x D x H)	1200 x 1750 x 2100
Dimensions (utilities cabinet)	mm (W x D x H)	700 x 1500 x 1700

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