Cutting 1 mm Diameter Holes in 8 mm Thick Polycrystalline Silicon

This video shows how cutting 1 mm diameter holes in 8 mm thick polycrystalline silicon using Synova Laser MicroJet®.

Cycle time: 22 seconds

Taper angle: 0.036°

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Read 199 times Last modified onMar 29, 2023

Published in Videos

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LMJ Applications

Edouard Boisset

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