The LMJ mechanism guides the laser beam over distances of up to 10 cm without requiring focusing or distance control, enabling narrow and highly parallel cuts in materials from 1 to 40 mm in thickness. Synova’s LMJ technology resolves significant problems that are commonly associated with nanosecond lasers: thermal damage, contamination, deformation, debris deposition, oxidation, micro-cracks, and taper. The technology can also be used with UV, visible, and NIR sources. Applied to the semiconductor and consumer electronics industries, the LMJ method enables the cutting, grooving, and dicing of sensitive materials, resulting in smooth edges, high wafer fracture strength, and an overall reduction in the risk of breakage. Further, this technology enables precise cutting of various semiconductor materials, such as silicon, gallium arsenide, silicon carbide, low-K dielectrics, and even coated materials such as epoxy-molded compound wafers of various thicknesses between 50 µm and 2 mm.
Articles
Laser Microprocessing Conquers the Challenge of Ultrafine Components
Certain hybrid machining methods enable the use of nanosecond lasers for high-throughput processing tasks for the semiconductor and consumer electronics industries, while mitigating the drawbacks that are inherent to these sources. One example is Synova’s laser MicroJet (LMJ) technology, which combines a laser with a thin water jet. This jet uses total internal reflection to precisely guide the beam in a manner similar to that which can be achieved via conventional optical fibers.
By Antonio Castelo