Share

Laser MicroJet® systems: Cutting a Silicon Slotted Ring

Applications

Watch this video to see how Laser MicroJet® (LMJ) is used to cut 45 mm long slots into silicon. Material: Silicon; Thickness: 7.7 mm; Effective processing speed: under 2 min per slot. Slots were cut under 2 minutes on average. Waste parts fall down and can be recycled. 

Are you interested in a demo?

Fill out the form and we’ll get back to you as soon as possible.

laser-target