Share

Cutting 1 mm Diameter Holes in 8 mm Thick Polycrystalline Silicon

Applications

https://www.youtube.com/watch?v=p-qKEB5q58w

This video shows how cutting 1 mm diameter holes in 8 mm thick polycrystalline silicon using Synova Laser MicroJet®.

Cycle time: 22 seconds

Taper angle: 0.036°

Are you interested in a demo?

Fill out the form and we’ll get back to you as soon as possible.

laser-target