
New Application Video: Wafer Dicing & Fancy Shape Cutting
Experience the precision of our Laser MicroJet® technology as it processes a SiC wafer for the semiconductor industry. This video showcases our S-303 machine executing multiple cutting shapes, including wafer dicing, hole drilling, and sharp triangles cutting.
By combining water and light, we resolve the significant problems associated with dry lasers such as thermal damage, contamination, deformation, debris deposition, oxidation, micro-cracks and taper.
Watch the video here