New Application Video: Wafer Downsizing, Notch and Flat
Discover the capabilities of our LCS 303 3-axis laser cutting system while processing a SiC wafer for the semiconductor industry. Whether you need precise wafer downsizing, notch, or flat cutting, our Laser MicroJet® is renowned for its high precision and reliability.
By combining water and light, we resolve the significant problems associated with dry lasers such as thermal damage, contamination, deformation, debris deposition, oxidation, micro-cracks and taper.
Watch the video here