Semiconductor dicing and grinding systems are able to perform cutting and scribing of brittle thin wafers, such as low-k or compound wafers, as well as multi-directional 2D-cutting providing engineers with the capability to create new chip shapes spanning T-cuts and circular designs with the same quality as standard die patterns. The gentle Laser MicroJet® (LMJ) method enables the cutting, grooving and dicing of sensitive materials resulting in smooth edges, high wafer fracture strength and less risk of breakage.
Synova’s LMJ systems are low-cost-of-ownership tools that demand very few consumables and no tool wear. The high-throughput capability especially for thin wafers combined with its nearly damage-free technology (no HAZ, chipping, micro-cracks, burrs or deposition) allows customers to realize cost benefits by increasing yield.