Synova - Laser MicroJet - laser cutting system - water jet guided laser cutting, dicing, grooving, wafer edge grinding

	Welcome

A new generation is here:
the water jet-guided laser cutting systems

Laser MicroJet^®

Synova is a leading provider of innovative laser cutting systems for a broad range of micromachining and dicing applications. Our aim is to provide leading-edge device manufacturers with superior manufacturing and cost-competitive advantages through the use of our technology.

Our proprietary Laser MicroJet®, a water jet-guided laser cutting technology, is rapidly emerging as the ideal industrial solution for meeting the demanding manufacturing specifications and low cost-of-ownership requirements associated with high-volume production of today’s advanced electronic and micromechanical devices. With this unique, patented Laser MicroJet® technology, the laser beam is focused and guided into a hair-thin, low-pressure water jet to precisely target material process steps such as cutting, grooving and scribing.

This revolutionary technology delivers cutting quality unrivalled by that of conventional techniques, such as lasers and diamond saw blade, enabling device manufacturers to process advanced materials without subjecting them to heat damage, contamination and deformation. In addition, Laser MicroJet® provides customers with considerable economical benefits, such as increased manufacturing yields and lower cost per unit, thanks to the technology’s superior speed and accuracy.

Synova provides fully automated turnkey laser cutting systems to several industries - the semiconductor, electronics (i.e. flat-panel displays and MEMS), photovoltaic, diamond, tooling, medica, automobile, watch and micromechanics markets. In addition, Synova offers Laser MicroJet® modules for end-user integration, and has recently made its core Laser MicroJet® technology available to select equipment manufacturers through licensing partnerships.