Home

• Welcome to Synova

Company Profile

• Synova Overview
• Company Purpose
• Corporate Philosophy / Synova Values
• Synova International Organisation
• Corporate Intellectual Property
• Company Awards

Technology

• Water Jet Guided Laser for Micro-Machining / Precision Cutting
• Laser MicroJet^® Comparison with Conventional Laser or Water Jet Cutting

Applications

• Applications for Laser MicroJet^®
• Semiconductor, Silicon Wafer
• Electronics, FPD, Sheet Metal Masks
• Medical Devices, Stents
• Automobile, Catalytic Converters
• Tooling, Hard Materials
• Solar Energy, Photovoltaic Cells
• Precision Metal Parts, Watch Making

Events

• Conferences / Technical Papers on Laser MicroJet^®
• Exhibitions / Trade Shows
• Other media events

Publications

• Synova Press Releases
• Laser MicroJet^® Articles / Publications in Magazines
• Newsletters from Synova

Careers

• Job Openings at Synova
• Human Resources

Contact

• Synova Contact Request
• Directions for Synova Headquarters
• Synova Local Subsidiaries

Search

• Search Engine for Synova website

Products

• Automated Turnkey Systems
• Laser Dicing Machine – LDS
• Laser Grinding Machine – LGS
• Laser Stencil Machine – LSS
• Laser Cutting Machine – LCS
• Hybrid Laser Saw System - HLS
• Integration Modules
• Laser MicroJet integration Package

Services

• Application Development and Sample Testing
• Micro Machining Center
• Leasing Offer

Solutions

• Automobile
• Compound semiconductors
• Electronics
• Ferrite Cores
• FDP
• Fracture strength
• Gallium Arsenide
• GaN-based LEDs
• Hard Disk Drive head
• Laser Cutting System
• Laser Dicing System
• Laser Edge Grinding System
• Laser MicroJet^®
• Laser Stencil System
• LaserTape^®
• Low Temperature Co-fired Ceramics
• Low-k Wafers
• Medical
• Medical devices
• MEMS
• Metal Mask
• Multi-project Wafers
• Photovoltaic (PV) Solar Cells
• Power Semiconductors
• Semiconductors
• SiC
• Solar Energy
• Stencils
• Stents
• Super Hard Materials (CBN/Silicon Nitride/Diamond)
• Thin Wafers
• Tooling
• Wafer Bump Stencils
• Wafer dicing
• Wafer drilling and slotting
• Wafer edge grinding
• Water Film Device^®
• Water jet guided laser technology