Solutions
Synova is continuously developing new technological solutions and innovative laser cutting systems for the semiconductor, electronic, tooling, medical, automotive, and solar industries. Synova’s vast know-how, skills and experience are expressed through the below application notes, press articles, conference presentations, newsletters and other publications. Please select any relevant key words in order to gain access to more information .


Automobile
Compound semiconductors
Electronics
Ferrite Cores
FPD
Fracture strength
Gallium Arsenide
GaN-based LEDs
Hard Disk Drive head
HBLED
Hybrid Dicing - Hybrid Laser Saw
Injection Nozzle
Laser Chemical Processing of Solar Cells
Laser Cutting System
Laser Dicing System
Laser Doping
Laser Edge Grinding System
Laser MicroJet®
Laser Stencil System
LaserTape®
Low Temperature Co-fired Ceramics
Low-k Wafers
Medical
Medical Devices
MEMS
Metal Mask
Multi-project Wafers
OLED
Photovoltaic (PV) Solar Cells
Power Semiconductors
Precision Metal Parts
PZT
Semiconductors
SiC
Solar Energy
Stencils
Stents
Super Hard Materials (CBN/Silicon Nitride/Diamond)
Thin Film Solar Cell
Thin Wafers
Tooling
Wafer Bump Stencils
Wafer dicing
Wafer drilling and slotting
Wafer edge grinding
Water Film Device®
Water jet guided laser technology