The Laser MicroJet® enables quality cutting of various semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-κ materials.

The main applications are wafer dicing, edge grinding, scribing, hole drilling, slotting, grooving, inking, isolating, thinning and marking.  Specific applications have been developed for the processing of thin (or ultra-thin) wafers, multi-projects wafers, power semiconductors, and light-emitting diodes. 

The water jet-guided laser performs omni-directional cuts with high accuracy (+/- 3 µm) at speeds up to 300 mm/s, while eliminating chipping, deposition, thermal damage and mechanical stress. 

Initially Synova supplied a proprietary LaserTape® for use with its machines. However, extensive in-house studies carried out with widely available commercial dicing tapes have shown that suitable standard tape from selected suppliers can also be used, thus reducing the production requirements and costs for the machine users.

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