Synova’s state-of-the-art laser cutting machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet® technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical stress.  Our tools have been repeatedly field proven and are used for 24-hour-a-day industrial production.

Synova currently offers four types of water jet-guided laser cutting machines:

• LDS – Laser Dicing Machines
• LGS – Laser Edge Grinding Machines
• LSS – Laser Stencil Cutting Machines
• LCS – Laser Cutting Machines

In addition, Synova offers a manual Laser Chemical Doping System developed in collaboration with the Frauenhofer Institute:

• LCP – Laser Doping System

as well as products offered in cooperation with partners (see OEM products):

• HLS – Hybrid Laser Saw System
• Microfor HP1 Laser for injection nozzle perforation
• RenaSynova Laser Technology
• Triveni Diamond Cutting System

Cutting Machine Specifics

Synova laser cutting machines feature absolute precision from ± 3 to 5 µm and large processing areas that range between 150 x 150 and 800 x 1200 mm.  The high-precision, high-speed XY-table, based on the principle of separate axes on a granite base, allows unmatched accuracy and dynamic. The axes are driven by linear motors at a maximum speed of 1,000 mm/s.  Pulsed Nd:YAG lasers (infrared, green or UV) are typically used and the water jet diameter ranges from 22 to 75 µm.

All machines are equipped with vision cameras and powerful image treatment software, allowing automatic alignment and quality inspection.  The operation interface is a flat color screen with touch panel, the machine software is based on MS Windows 2000^®. The machine can be connected to a LAN for data transmission and remote diagnostic service.  Adapted CAM software can quickly and easily convert all DXF and Gerber data without any special programming. 

Options include a fully automated handling system, chiller, alternative laser sources, water treatment system, reference scales and transformers.