The Laser MicroJet® is well adapted to the manufacturing of metal masks, including stencils for PCB, wafer bump stencils and screens for flat panel displays (shadow or evaporation masks).  Metal sheets are cut quickly and accurately (up to 20 holes per second) without any heat damage, warping, burrs or oxidation.

Ferrite cores are also machined with precision; very narrow and parallel slits are typically cut in ring cores requiring a gap.  In addition, applications have been developed for the processing of ceramics, low temperature co-fired ceramics (LTCC) and radio frequency identification (RFID) systems.

The Laser MicroJet® is also used for cutting ferromagnetic ceramic materials, constituting the magnetoresistive head substrates for hard-disk drives.  Another recent application is trenching of silicon plates for inkjet printer heads.