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LDS 200 A - LDS 200 C - LDS 200 M - LDS 300 A |
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Laser Dicing Systems
Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
Axes |
Working area
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320 x 320 mm
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Maximum stroke (X x Y)
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700 x 400 mm
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Accuracy
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± 3µm
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Repeatability
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± 1µm
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Maximum axis speed
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1000 mm/s
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Maximum acceleration
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20 m/s2
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Laser |
Fiber laser, pulsed
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Wavelength
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532 or 1064 nm
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Power
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100 W
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Water pump |
Water pressure
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20 to 500 bars
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Nozzle diameter
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30µm, 35µm, 40µm, 50µm, 60µm, 75µm or 100µm
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Workpiece |
Wafer size
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25 to 300 mm
(1” to 12 ”) |
Cleaning |
High pressure cleaning
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Megasonic water jet cleaning
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Front and back side drying
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Loading |
1 cassette (8” or 12 ”)
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Dimension & Weight |
Dimension (W x D)
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1350 x 1200 mm
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Weight
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950 kg
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Download PDF brochure (requires Adobe Reader) 
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