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LDS 200 A - LDS 200 C - LDS 200 M - LDS 300 A |
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Laser Dicing Systems
The LDS 200 C includes a cleaning unit with DI water for automatic wafer cleaning after dicing.
Axes |
Working area |
240 x 240 mm |
Maximum stroke (X x Y) |
600 x 400 mm |
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Accuracy |
± 3µm |
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Repeatability |
± 1µm |
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Maximum axis speed |
1000 mm/s |
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Maximum acceleration |
20 m/s2 |
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Laser |
Solid state Nd:YAG, pulsed |
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Wavelength |
532 or 1064 nm |
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Power |
100 W |
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Water pump |
Water pressure |
20 to 500 bars |
Nozzle diameter |
30µm, 35µm, 40µm, 50µm, 60µm, 75µm or 100µm |
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Workpiece |
Wafer size |
25 to 203 mm (1” to 8”) |
Cleaning |
High pressure cleaning |
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Megasonic water jet cleaning |
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Front and back side drying |
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Dimension & Weight |
Dimension (W x D) |
1560 x 1100 mm |
Weight |
900 kg |
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Download PDF brochure (requires Adobe Reader)
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