Laser Dicing Systems

The Laser Dicing System is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications.

The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine including fast quality check (control of kerf width, position and roughness).

Axes	Working area	240 x 240 mm
	Maximum stroke (X x Y)	600 x 400 mm
	Accuracy	± 3µm
	Repeatability	± 1µm
	Maximum axis speed	1000 mm/s
	Maximum acceleration	20 m/s2
Laser	Solid state Nd:YAG, pulsed
	Wavelength	532 or 1064 nm
	Power	100 W
Water pump	Water pressure	20 to 500 bars
	Nozzle diameter	30µm, 35µm, 40µm, 50µm, 60µm, 75µm or 100µm
Workpiece	Wafer size	25 to 203 mm (1” to 8”)
Cleaning	High pressure cleaning
	Megasonic water jet cleaning
	Front and back side drying
Loading	Maximum of 3 cassettes (6” or 8”)
Dimension & Weight	Dimension (W x D)	1560 x 1100 mm
	Weight	950 kg
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