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Hybrid Laser Saw System
The fully automatic Hybrid Laser Saw integrates technologies from both Disco and Synova : Disco’s leading-edge dual-parallel spindle, fully automatic Dicing Saw and Synova’s Laser MicroJet® (LMJ) optical head module. This “2-in 1” turnkey system can dice up to 300 mm wafers in a fully automatic mode from cassette to cassette. This dual-approach offers optimum dicing results, both in throughput and yield, and provides users with the best of both worlds enabling top-quality and high yield processing results.
| Axes | Saw XYZ axis | Laser MicroJet® XY axis | ||
| X-Axis | Cutting range | 310 mm | 310 mm | |
| Max. cutting speed | 01-600 mm/s | 01-600 mm/s | ||
| Y1-Axis | Cutting range | 310 mm | 310 mm | |
| Index step | 0.1µm | 0.1µm | ||
| Positioning accuracy | 3 µm | 3 µm | ||
| Scale resolution | 0.1 µm interpolation | 0.1 µm interpolation | ||
| Z1-axis | Max. stroke | 14.7 (for Ø 2” blade) | n/a | |
| Moving resolution | 0.05 µm interpolation | |||
| Repeating accuracy | 1 µm | |||
| Max. blade size | 58 mm | |||
| Θ-axis | Max. rotating angle | 380 deg. | 380 deg. | |
| Spindle | Output | 1.2 kW at 60’000 min -1 | n/a | |
| Rated torque | 0.19 Nm | |||
| Revolution speed range | 6’000-60’000 min-1 | |||
| Laser | Diode pumped solid state Nd:YAG, pulsed | |||
| Wavelength | 1064 nm or 532 nm | |||
| Average power | 50-200W, various laser sources available | |||
| Water pump | Water pressure | 20 to 500 bar | ||
| Nozzle diameter | 30µm, 35µm, 40µm, 50µm, 60µm, 75µm or 100µm | |||
| Utilities | Power supply machine | 3x200V-240V (basic machine) – 3x400 V optional, with transformer 3x400V (water pump) 1x220V (laser) |
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| Air Pressure | 5-8 bar | |||
| Water pressure cooling | 2-4 bar | |||
| Wheel cooling water | 14 l/min | |||
| Spindle cooling water | 3.0 l/min at 0.3 MPa | |||
| Dimension & Weight | Dimension (W x D) | 1200x1550x1800 mm | ||
| Weight | 2050 kg without transformer 2150 with transformer |
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Download PDF brochure (requires Adobe Reader)
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