Diamond Cutting Systems

The Laser MicroJet® is particularly suited for cutting larger diamonds having a size of 5 mm. or more. Since no focal adjustment is required, a working distance of up to 30 millimetres is possible. Thus, a diamond can be cut in a single setting rather than from both sides as is the case
in conventional lasers.

This laser cutting system has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The work piece is fixed on a M6-thread table.