目前，微水刀激光的应用已开发了200多种，涉及半导体、电 子、医疗业、汽 车工业、工具和太阳能等诸多领域。”

Synova Laser-Microjet: a major advantage for Watch Industry

A major advantage in Edge Grinding Process of wafers

시노바 레이저 마이크로젯® (Laser-MicroJet®)을 이용한 웨이퍼 에지 그라인딩

Cutting of Diamonds with SYNOVA Laser MicroJet®

Cutting Injection Nozzles with SYNOVA Laser MicroJet®

Cutting PZT material with SYNOVA Laser MicroJet®

Photovoltaic (PV) cell edge isolation with Synova Laser MicroJet

Cutting of watch hands with Synova Laser MicroJet

Scribing / Ablation of thin films with Synova Laser MicroJet

Inkjet Print Head Slotting Using Laser MicroJet®

Hard-Disk Drive (HDD) Read Head Substrate Dicing with Laser MicroJet®

Mask Cutting for the Manufacturing of FPD with SYNOVA Laser MicroJet®

Cutting of Low-k Wafers with SYNOVA Laser MicroJet®

Scribing of GaN-based LEDs with SYNOVA Laser MicroJet®

Cutting of Medical Devices with SYNOVA Laser MicroJet®

Cutting of Low Temperature Co-fired Ceramics with SYNOVA Laser MicroJet®

Dicing of Gallium Arsenide Wafer with SYNOVA Laser MicroJet®

Cutting of Hybrid Ceramics with SYNOVA Laser MicroJet®

Cutting of Stents with SYNOVA Laser MicroJet®

Cutting of Photovoltaic (PV) Solar Cells with SYNOVA Laser MicroJet®

Cutting of Power Semiconductors in Silicon (Thyristors and Diodes) with SYNOVA Laser MicroJet®

Cutting of Super Hard Materials (CBN/Silicon Nitride/Diamond) with SYNOVA Laser MicroJet®

Drilling and Slotting of Wafers with SYNOVA Laser MicroJet®

Edge Grinding of Wafers with SYNOVA Laser MicroJet®

Cutting of Multi-Project Wafers (MPW) with SYNOVA Laser MicroJet®

Cutting of Wafer Bump Stencils with SYNOVA Laser MicroJet®

Cutting of Metal Masks (Stencils) with SYNOVA Laser MicroJet®

Cutting of Thin Wafers with SYNOVA Laser MicroJet®

Cutting of Ferrite Cores with SYNOVA Laser MicroJet®

Overview applications of SYNOVA Laser MicroJet®